One of the most crucial components in the semiconductor industry, photoresist resin is required for the fabrication of semiconductor devices in the modern era. A key component of patterning layers of material during production are photoresists.

Additionally, they provide good thermal stability, toughness, and chemical resistance during the etching process. Photoresists are now a crucial raw material when it comes to overcoming finer feature sizes down to the 10 nm node thanks to recent advancements in technology and processes like Nanoimprint lithography (NIL) combined with chemical mechanical planarization (CMP).

How should you choose a suitable photoresist resin for your application given these benefits? What you need to know about selecting a high-performance photoresist solution that satisfies your desired performance requirements will be explained in this post.

The photoresist resin

The primary structural element of photoresists is photoresist resin. It creates the polymeric matrix of the resist, giving the substrate the required adhesion, thermal stability, and chemical resistance. When the resin is exposed to UV light after being spin-coated onto the substrate, it goes through photochemical reactions that change its solubility and enable the formation of patterns with submicron features.

Both positive and negative photoresist types employ resins tailored to the task at hand, with various combinations of monomers and polymers producing various results. In order to achieve the desired pattern resolution and adhesion, as well as to increase the reproducibility and performance of the finished product, it is crucial to choose the right resin depending on the type of photoresist being used and the application.

Photoresist resin
Photoresist resin structure

Why photoresist resin is important to photolithography line?

Photoresist resin is essential to the photolithography line because it forms the resist’s polymeric matrix, providing adhesion, thermal stability, and chemical resistance to the substrate. The selection of the appropriate resin is crucial in achieving the desired pattern resolution and adhesion, improving the reproducibility and performance of the final product. Without photoresist resin, photolithography would not be possible, and electronic components’ manufacturing and design would be adversely affected.

What are the different photoresist resin requirements for different Photoresist styles?

Different photoresist styles require specific photoresist resin properties. Positive photoresists typically use novolac-based resins that provide high thermal stability, making them suitable for multiple patterning applications. In contrast, negative photoresists typically use polyhydroxystyrene to achieve high sensitivity and resolution, allowing for sub-20 nm feature sizes.

For biocompatible applications, photoresist resins may consist of biocompatible polymers and drug delivery compounds to enable compatibility with biological systems. The selection of the appropriate photoresist resin is crucial in achieving the desired performance and obtaining high-quality patterns on various substrates and materials. Scientists and professionals in the field must understand photoresist resin requirements to create successful microfabrication.

The Photoresist monomer structure for 193nm and 248nm photoresist resin?

The structure of the photoresist monomer differs between 193 nm and 248 nm photoresist resins. 193 nm photoresist monomers typically use cyclic olefins as the main monomer, with a methacrylate monomer as a compatibilizer to improve adhesion and sensitivity.

Other functional monomers, such as acid generators and photoacid generators, may also be added to enhance the photoresist’s properties. In contrast, 248 nm photoresist monomers typically use a combination of isopropenyl and methacrylate monomers. These monomers can create resins with desirable properties, such as good sensitivity, resolution, and etch resistance. Understanding the differences in photoresist monomer structure is essential in selecting the appropriate photoresist for different applications in microfabrication.

Why Photoresist monomer is the key components for photoresist resin?

Photoresist monomers are the essential photoresist components of photoresist resin because they form the polymeric matrix of the photoresist. The monomers’ chemical structures determine the resist’s properties, such as sensitivity, contrast, and resolution. The photoresist monomers undergo photochemical reactions when exposed to UV light, enabling pattern formation.

Different monomer combinations yield different properties, making monomer selection crucial in achieving the desired result. The proper selection of photoresist monomer ensures the photoresist’s physical and chemical stability during the photolithography process and ensures high quality and consistency in the final product. Understanding the role of photoresist monomers is essential in achieving high-quality microfabrication results.

Why should you choose Dakenchem for the Photoresist monomer?

Choosing Dakenchem for photoresist monomer guarantees good performance and stable quality. The monomer is the raw material of synthetic resin, and its properties play a crucial role in determining the photolithographic performance and etching resistance of the photoresist. Every link in the synthesis process affects the end product, requiring monomers with reliable performance and stable quality.

Dakenchem’s 40 years of experience in fine chemical synthesis and expertise in research and development ensure the production of monomers with exceptional quality and stability. With a young, highly-educated technology team and numerous national and provincial-level projects, patents, papers, and awards, Dakenchem is the trusted photoresist monomer supplier for those seeking quality photoresist monomers.

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