The Foundation of Next-Gen Microelectronics & 5G: High-Performance BCB
Benzocyclobutene (BCB) resins offer unparalleled dielectric properties and planarization for advanced semiconductor packaging and high-frequency communication devices.
Key Specifications
Core Technical Advantages
Engineered for extreme reliability in challenging microelectronic environments.
Extreme Electrical Performance
Dk(2.5-2.7) and Df(0.0008-0.002) significantly better than PI (3.2-3.5/0.002-0.01). Ideal for 5G mmWave and high-speed digital circuits, achieving lower signal delay and transmission loss.
Zero Water Absorption
< 0.2% moisture uptake, far lower than PI's 1-3%. Ensures stable electrical performance in humid environments, critical for automotive electronics and aerospace packaging.
Lower Curing Temperature
Cures at 200-250°C, significantly lower than PI imidization (350-400°C). Lower thermal budget protects sensitive active devices and reduces wafer warpage risk.
Nano-scale Self-Planarization
Achieves global planarization via thermal reflow, eliminating the need for extra CMP processes. PI planarization is limited and easily accumulates step height in multi-layer stacks.
Pure Addition Reaction
Thermal ring-opening polymerization produces no volatile by-products, no shrinkage, and no air bubble defects. PI precursors release water molecules during imidization, leading to pinholes.
Superior Thermal Stability
Exhibits exceptional thermal stability (Td ~450°C after cross-linking), vastly outperforming VBC (Td ~300-350°C). While VBC targets resins, BCB is purpose-built for extreme microelectronic environments.
Competitive Analysis
Understanding the strategic placement of BCB in the advanced materials landscape.
The High-Speed Upgrade
While Polyimide (PI) offers excellent flexibility and high-temperature resistance, BCB provides critical advantages for next-generation, high-frequency microelectronics.
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Higher Frequency Performance: Superior Dk/Df makes BCB essential for 5G and mmWave.
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Lower Water Absorption: Significantly lower moisture uptake ensures stability compared to typical PI.
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Better Planarization: BCB's self-planarizing nature simplifies multi-layer processing.
| Property | BCB Series | Polyimide (PI) |
|---|---|---|
| Dk (10GHz) | 2.5 - 2.7 | 3.2 - 3.5 |
| Df (10GHz) | 0.0008 - 0.002 | 0.002 - 0.01 |
| Water Absorption | < 0.2% | 1 - 3% |
| Curing Temp | 200 - 250°C | 350 - 400°C |
| Planarization | Excellent (>90%) | Average |
| Thermal Stability | ~450°C | >500°C |
| Film Thickness | 1 - 25μm | 1 - 100μm+ |
Divergent Application Paths: BCB vs VBC
A technical comparison of chemical properties and industrial use cases.
| Comparison Dimension | BCB (Benzocyclobutene) | VBC (Vinylbenzyl Chloride) |
|---|---|---|
| Curing Mechanism | Thermal ring-opening polymerization, no catalyst, no volatiles. | Free radical/cationic polymerization or nucleophilic substitution of chloromethyl. |
| Curing Temperature | 200-300°C | Usually requires initiator, 60-120°C |
| Dielectric Constant (Dk) | 2.5-2.7 | ~2.9-3.2 |
| Dielectric Loss (Df) | 0.0008-0.002 | ~0.01-0.02 |
| Water Absorption | <0.2% | ~1-2% |
| Main Applications | Microelectronics packaging, optoelectronic devices, high-frequency communication. | Ion exchange resin, water treatment membrane, coating crosslinker. |
| Thermal Stability | Td~450°C (after crosslinking) | Td~300-350°C |
| Planarization Ability | Excellent (self-planarizing) | Average |
2026 Technology Frontier
Fluorinated Derivatives Platform
Leveraging tetrafluoroacetone as a core platform to develop high-purity, high-performance electronic-grade derivatives for next-generation lithography and optoelectronics.
Phenylpropylcyclobutene Overview
A rigid cyclobutene backbone engineered with distinct phenyl and propyl modifications. This unique structure provides high reactivity specifically tuned for controlled ring-opening polymerization processes.
Technical Specifications
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Core Groups Phenyl & Propyl substituted
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Solubility Broad solvent compatibility
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Reactivity High ring-opening affinity
Structural Tension & Stability
Stable at room temperature while allowing for highly controlled 'living' polymerization under specific thermal or catalytic conditions.
Multifunctional Modification
The synergistic phenyl + propyl combination provides enhanced matrix compatibility and robust chemical anchors for further functionalization.
Batch Consistency
Subjected to rigorous quality control, ensuring stringent limits on water content, trace impurities, and precise optical features.
Application Areas
Advanced Polymers
High-performance network structures for demanding microelectronic applications.
Pharmaceuticals
Critical intermediates for complex drug discovery and synthesis.
Organic Electronics
Next-generation optoelectronic materials for flexible displays.
Academic Research
High-purity building blocks for advanced materials science exploration.
Quick Reference Parameters
BCB Product Series
Explore our comprehensive range of BCB derivatives.
| Product Name | CAS NO. | Molecular Structure | Derivative Category | Application |
|---|---|---|---|---|
| CAS NO.144597-22-8 4-Ethynylbenzocyclobutene | 144597-22-8 |
|
Functional Derivative | Advanced Packaging |
| CAS NO.145708-73-2 Bicyclo[4.2.0]octa-1,3,5-triene-2,5-dicarboxylic acid | 145708-73-2 |
|
Polar Functional Group | Dielectric Layer |
| CAS NO.55337-80-9 1-Methyl-1,2-dihydrocyclobutabenzene | 55337-80-9 |
|
Basic Skeleton | Synthesis Intermediate |
| CAS NO.61599-88-0 7-chlorobicyclo[4.2.0]octa-1,3,5-triene | 61599-88-0 |
|
Basic Skeleton | Synthesis Intermediate |
| CAS NO.250337-98-5 4-Aminobenzocyclobutene | 250337-98-5 |
|
Halogenated Intermediate | OLED Synthesis |
| CAS NO.65886-91-1 3-(chloromethyl)-Bicyclo[4.2.0]octa-1,3,5-triene | 65886-91-1 |
|
Halogenated Intermediate | Photoresist Precursor |
| CAS NO.1810070-03-1 Bicyclo[4.2.0]octa-1,3,5-trien-3-amine hydrochloride | 1810070-03-1 |
|
Polar Functional Group | Pharmaceutical Precursor |
| CAS NO.35447-99-5 Bicyclo[4.2.0]octane-1,3,5-triene-7-ol | 35447-99-5 |
|
Polar Functional Group | Organic Synthesis |
| CAS NO.132170-05-9 2,5-Bis(trimethylsilyl)bicyclo[4.2.0]octa-1,3,5-triene | 132170-05-9 |
|
Silane Coupling Type | Adhesion Promoter |
| CAS NO.117732-87-3 DVS-BCB | 117732-87-3 |
|
Polymerization Monomer | Advanced Packaging Dielectrics |
| CAS NO.145708-71-0 2,5-DibromoBenzocyclobutene | 145708-71-0 |
|
Halogenated Intermediate | OLED Crosslinker |
| CAS NO.694-87-1 Benzocyclobutene | 694-87-1 |
|
Basic Skeleton | Synthesis Core Backbone |
| CAS NO.99717-87-0 4-Vinylbenzocyclobutene | 99717-87-0 |
|
Functional Derivative | Polymer Crosslinking Agent |
| CAS NO.3469-06-5 Benzocyclobutenone | 3469-06-5 |
|
Basic Skeleton | Pharmaceutical Intermediate |
| CAS NO.35095-07-9 1,2-Dihydrobenzocyclobutene-1-carboxylic acid methyl ester | 35095-07-9 |
|
Polar Functional Group | Specialty Polymers |
| CAS NO.14381-41-0 Benzocyclobutyl-1-carboxylic acid | 14381-41-0 |
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Polar Functional Group | Organic Synthesis |
| CAS NO.15100-35-3 1-Hydroxymethylbenzocyclobutene | 15100-35-3 |
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Polar Functional Group | Organic Synthesis |
| CAS NO.21120-91-2 1-Bromobenzocyclobutene | 21120-91-2 |
|
Halogenated Intermediate | Halogenated Intermediate |
| CAS NO.53076-11-2 4-Hydroxymethylbenzocyclobutene | 53076-11-2 |
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Polar Functional Group | Synthesis Intermediate |
| CAS NO.112892-88-3 4-Carboxaldehydebenzocyclobutene | 112892-88-3 |
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Polar Functional Group | Optoelectronic Materials |
| CAS NO.195730-31-5 Benzocyclobutene-4-boronic acid | 195730-31-5 |
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Polar Functional Group | Suzuki Coupling / OLED |
| CAS NO.55716-66-0 4-Aminobenzocyclobutene | 55716-66-0 |
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Polar Functional Group | Polyimide Crosslinker |
| CAS NO.124389-79-3 4-[2-(Triethoxysilyl)vinyl]benzocyclobutene | 124389-79-3 |
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Silane Coupling Type | Silane Coupling Agent |
| CAS NO.875-94-5 4-Carboxylbenzocyclobutene | 875-94-5 |
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Polar Functional Group | Crosslinking Agent |
| CAS NO.1073-39-8 4-Bromobenzocyclobutene | 1073-39-8 |
|
Halogenated Intermediate | Synthesis Intermediate |
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